Peter Currie-Smith
October 15th, 2001, 10:46 PM
The basic Inverse Power Law correlation between two temperature cycling regimes says that
No. of cycles to failure x (Temp change)^k = const
The Coffin-Manson model for thermal fatigue failure sets the factor k above to 2.
I am interested in the experience of other people with the range of values for k in the area of thermal fatigue of electronic components including soldered connections.
Regards
No. of cycles to failure x (Temp change)^k = const
The Coffin-Manson model for thermal fatigue failure sets the factor k above to 2.
I am interested in the experience of other people with the range of values for k in the area of thermal fatigue of electronic components including soldered connections.
Regards