Reducingeliminate Burnin

[Kahsai]

[Originally Posted: 4/14/00-- Transferred by ReliaSoft Moderator]

Our product is a personal computer. The Printed Circuit Assembly has about 1000 component. The ICs package are surface mount BGAs, microprocessor,etc. Currently we do dynamic burn-in for 6 hours temp range 5 degree C to 40 degree C. Our yield is 85%. What method should I use to eliminate or reduce the burn-in time? Thanks Kahsai

[ReliaSoft Tech. Support]

[Originally Posted: 4/26/00-- Transferred by ReliaSoft Moderator]

We would have to know a little more about your product/program to full answer this question. For example, what is the ramp rate of the temperature change? How many thermal cycles take place over the six-hour period? What are the spec. and operational limits of your product? Do all of the products produce undergo this burn-in?

[Matt]

[Originally Posted: 6/27/00--Transferred by ReliaSoft Moderator]

There is no right or wrong answer with burn-in. My experience shows you must run practical, real world experiments to understand the important factors for stressing cards. These answers are product specific, such that burn-in experiments must be run on your product.

Matt